Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 025674/0464 | |
| Pages: | 4 |
| | Recorded: | 01/21/2011 | | |
| Attorney Dkt #: | CHIP.0112 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2013
|
Application #:
|
13010880
|
Filing Dt:
|
01/21/2011
|
|
Publication #:
|
|
Pub Dt:
|
10/06/2011
| | | | |
|
Title:
|
MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MODULE WITH PACKAGE STRUCTURE
|
|
|
Assignee
|
|
|
|
|
| NO. 84, TAI-HO RD., CHU-PEI |
| CHU-PEI CITY, HSIN-CHU HSIEN, TAIWAN 30267 |
|
|
Correspondence name and address
|
| |
JUAN CARLOS A. MARQUEZ
|
| |
1199 N. FAIRFAX STREET, SUITE 900
|
| |
STITES & HARBISON PLLC
|
| |
ALEXANDRIA, VA 22314
|
Search Results as of:
09/23/2024 05:27 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
