Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 062780/0465 | |
| Pages: | 8 |
| | Recorded: | 02/17/2023 | | |
Attorney Dkt #: | 509265/2423 |
Conveyance: | ASSIGNMENT OF PATENT SECURITY INTEREST PREVIOUSLY RECORDED AT REEL/FRAME (038684/0563) |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/23/2018
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Application #:
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14927361
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Filing Dt:
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10/29/2015
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Publication #:
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Pub Dt:
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05/04/2017
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Title:
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Semiconductor Device and Method of Forming DCALGA Package Using Semiconductor Die with Micro Pillars
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Assignee
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10 S. DEARBORN |
FLOOR L2 |
CHICAGO, ILLINOIS 60603 |
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Correspondence name and address
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COURTNEY WELSHIMER
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425 LEXINGTON AVENUE
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NEW YORK, NY 10017
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06/19/2024 08:34 PM
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