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Reel/Frame:004964/0466   Pages: 4
Recorded: 10/28/1988
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
5028983
Issue Dt:
07/02/1991
Application #:
07263835
Filing Dt:
10/27/1988
Title:
MULTILEVEL INTEGRATED CIRCUIT PACKAGING STRUCTURES
Assignors
1
BICKFORD, HARRY R.
Exec Dt:
09/30/1988
2
BREGMAN, MARK F.
Exec Dt:
09/30/1988
3
CIPOLLA, THOMAS M.
Exec Dt:
09/30/1988
4
GOW, JOHN III
Exec Dt:
10/12/1988
5
LEDERMANN, PETER G.
Exec Dt:
10/03/1988
6
MIERSCH, EKKEHARD F.
Exec Dt:
10/04/1988
7
OLSON, LEONARD T.
Exec Dt:
10/14/1988
8
PAGNANI, DAVID P.
Exec Dt:
10/13/1988
9
REILEY, TIMOTHY C.
Exec Dt:
10/20/1988
10
TSOU, UH-PO E.
Exec Dt:
10/12/1988
11
VILKELIS, WALTER V.
Exec Dt:
10/04/1988
Assignee
1
INTERNATIONAL BUSINESS MACHINES CORPORATION
A CORP. OF NEW YORK
ARMONK, NEW YORK 10504
Correspondence name and address
DANIEL P. MORRIS
INTELLECTUAL PROPERTY LAW DEPT.
IBM CORP., P. O. BOX 218
YORKTOWN HEIGHTS, NY 10598

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