Patent Assignment Details
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| Reel/Frame: | 051730/0466 | |
| Pages: | 5 |
| | Recorded: | 02/05/2020 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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06/21/2005
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Application #:
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10422749
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Filing Dt:
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04/25/2003
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Publication #:
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Pub Dt:
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10/30/2003
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Title:
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A CONNECTION TERMINAL AND A SEMICONDUCTOR DEVICE INCLUDING AT LEAST ONE CONNECTION TERMINAL
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Patent #:
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Issue Dt:
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02/15/2005
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Application #:
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10766909
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Filing Dt:
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01/30/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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PHOTODETECTION SENSOR
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Patent #:
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Issue Dt:
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12/20/2011
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Application #:
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12312982
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Filing Dt:
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09/29/2009
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Publication #:
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Pub Dt:
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02/04/2010
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Title:
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IC CHIP PACKAGE AND IMAGE DISPLAY DEVICE INCORPORATING SAME
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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12734510
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Filing Dt:
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05/06/2010
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Publication #:
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Pub Dt:
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09/16/2010
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Title:
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SEMICONDUCTOR APPARATUS PACKAGING STRUCTURE HAVING EMBOSSED TAPE OVER TAB TAPE, THE EMBOSSED TAPE AND METHOD OF FORMING THE SEMICONDUCTOR APPARATUS PACKAGING STRUCTURE
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Patent #:
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Issue Dt:
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06/18/2013
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Application #:
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12805621
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Filing Dt:
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08/10/2010
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Publication #:
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Pub Dt:
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02/24/2011
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Title:
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Semiconductor device and method for manufacturing the same
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD
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SUITE 100E
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FALLS CHURCH, VA 22042
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