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Reel/Frame:020204/0467   Pages: 5
Recorded: 12/06/2007
Attorney Dkt #:2136-3018
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 020182 FRAME 0521. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR'S NAME: SE HOON PARK.
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11947574
Filing Dt:
11/29/2007
Publication #:
Pub Dt:
11/27/2008
Title:
CHIP EMBEDDED PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
Assignors
1
Exec Dt:
11/21/2007
2
Exec Dt:
11/21/2007
3
Exec Dt:
11/21/2007
4
Exec Dt:
11/21/2007
5
Exec Dt:
11/21/2007
6
Exec Dt:
11/21/2007
Assignee
1
68, YATAP-DONG, BUNDANG-GU
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
JONATHAN Y. KANG, ESQ.
660 SOUTH FIGUEROA STREET
SUITE 2300
LOS ANGELES, CA 90017

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