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Patent Assignment Details
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Reel/Frame:008533/0468   Pages: 2
Recorded: 03/27/1997
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/10/1998
Application #:
08826137
Filing Dt:
03/27/1997
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER MANUFACTURED BY THE SAME, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR EPITAXIAL WAFER
Assignor
1
Exec Dt:
03/11/1997
Assignee
1
CHIYODA-KU
4-2, MARUNOUCHI 1-CHOME
TOKYO, JAPAN
Correspondence name and address
LOEB & LOEB LLP
ROGER R. WISE
10100 SANTA MONICA BLVD., STE. 2200
LOS ANGELES, CA 90067-4164

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