Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 057164/0468 | |
| Pages: | 6 |
| | Recorded: | 08/12/2021 | | |
Attorney Dkt #: | 31183-03A/3B (AES) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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09/21/2021
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Application #:
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16334098
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Filing Dt:
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03/18/2019
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Publication #:
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Pub Dt:
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12/05/2019
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Title:
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Copper Deposition in Wafer Level Packaging of Integrated Circuits
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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17400633
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Filing Dt:
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08/12/2021
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Publication #:
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Pub Dt:
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12/16/2021
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Title:
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Copper Deposition in Wafer Level Packaging of Integrated Circuits
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Assignee
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245 FREIGHT STREET |
WATERBURY, CONNECTICUT 06702 |
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Correspondence name and address
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CARMODY TORRANCE SANDAK & HENNESSEY LLP
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195 CHURCH STREET
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PO BOX 1950
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NEW HAVEN, CT 06509-1950
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06/07/2024 04:46 PM
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