Patent Assignment Details
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| Reel/Frame: | 020911/0470 | |
| Pages: | 6 |
| | Recorded: | 04/29/2008 | | |
| Conveyance: | RECORD TO CORRECT THE ASSIGNEE'S ADDRESS, PREVIOUSLY RECORDED AT REEL 020454 FRAME 0379. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10607942
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Filing Dt:
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06/27/2003
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Publication #:
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Pub Dt:
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12/30/2004
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Title:
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METHOD FOR DETERMINING ENDPOINT OF ETCH LAYER AND ETCHING PROCESS IMPLEMENTING SAID METHOD IN SEMICONDUCTOR ELEMENT FABRICATION
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Assignee
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| 1 SILICON DRIVE, SAMA JAYA FREE |
| INDUSTRIAL ZONE |
| KUCHING, SARAWAK, MALAYSIA 93350 |
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Correspondence name and address
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LAWRENCE Y.D. HO & ASSOCIATES PTE LTD
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30 BIDEFORD ROAD, #02-02, THONGSIA BUILD
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SINGAPORE 229922
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