Patent Assignment Details
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Reel/Frame: | 023377/0471 | |
| Pages: | 3 |
| | Recorded: | 10/15/2009 | | |
Attorney Dkt #: | 21722/0212700-US0 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/09/2012
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Application #:
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12579127
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Filing Dt:
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10/14/2009
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Publication #:
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Pub Dt:
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04/15/2010
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Title:
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METHOD FOR SIMULTANEOUSLY CUTTING A COMPOUND ROD OF SEMICONDUCTOR MATERIAL INTO A MULTIPLICITY OF WAFERS
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Assignee
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HANNS-SEIDEL-PLATZ 4 |
MUNICH, GERMANY 81737 |
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Correspondence name and address
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DARBY & DARBY PC
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PO BOX 770
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NEW YORK, NY 10008-0770
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