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Reel/Frame:024073/0471   Pages: 2
Recorded: 03/12/2010
Attorney Dkt #:KSTR 200011US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/19/2013
Application #:
12161657
Filing Dt:
03/12/2010
Publication #:
Pub Dt:
09/16/2010
Title:
METHOD OF ETCHING A SILICON-BASED MATERIAL
Assignors
1
Exec Dt:
08/13/2008
2
Exec Dt:
08/19/2008
Assignee
1
9400 GARSINGTON ROAD
OXFORD BUSINESS PARK
OXFORD OX4 2HN, UNITED KINGDOM
Correspondence name and address
FAY SHARPE LLP
1228 EUCLID AVENUE, 5TH FLOOR
THE HALLE BUILDING
CLEVELAND, OH 44115

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