Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031494/0471 | |
| Pages: | 5 |
| | Recorded: | 10/24/2013 | | |
| Attorney Dkt #: | TSM13-0854 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY'S COUNTRY FROM CHINA TO TAIWAN PREVIOUSLY RECORDED ON REEL 031335 FRAME 0636. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/11/2018
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Application #:
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14044504
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Filing Dt:
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10/02/2013
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Publication #:
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Pub Dt:
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04/02/2015
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Title:
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SEMICONDUCTOR BONDING STRUCTURES AND METHODS
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 R.O.C. |
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Correspondence name and address
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SLATER & MATSIL, L.L.P.
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17950 PRESTON RD.
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STE. 1000
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DALLAS, TX 75252
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