Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 042792/0473 | |
| Pages: | 4 |
| | Recorded: | 06/22/2017 | | |
Attorney Dkt #: | 66116-US-PA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2018
|
Application #:
|
15630940
|
Filing Dt:
|
06/22/2017
|
Publication #:
|
|
Pub Dt:
|
07/26/2018
| | | | |
Title:
|
THIN FAN-OUT MULTI-CHIP STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
|
|
Assignee
|
|
|
NO.26, DATONG RD., HUKOU TOWNSHIP, |
HSINCHU COUNTY, TAIWAN 303 |
|
Correspondence name and address
|
|
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
|
|
7 FLOOR-1, NO. 100
|
|
ROOSEVELT ROAD, SECTION 2
|
|
TAIPEI, 100 TAIWAN
|
Search Results as of:
09/23/2024 08:21 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|