Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 015312/0474 | |
| Pages: | 10 |
| | Recorded: | 10/28/2004 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08727973
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Filing Dt:
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10/09/1996
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Title:
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CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND BUMP-TYPE CONTACT HEAD AND SEMICONDUCTOR COMPONENT PACKAGING MODULE USING THE CIRCUIT BOARD
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09173345
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Filing Dt:
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10/15/1998
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Title:
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CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND BUMP-TYPE CONTACT HEAD AND SEMICONDUCTOR COMPONENT PACKAGING MODULE USING THE CIRCUIT BOARD
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Patent #:
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Issue Dt:
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02/26/2002
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Application #:
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09633438
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Filing Dt:
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08/07/2000
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Title:
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Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
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Assignee
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| 5668-1, FUKUDA, YAMATO-SHI |
| KANAGAWA, JAPAN |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C.
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LEONARD HOLTZ
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767 THIRD AVENUE, 25TH FLOOR
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NEW YORK, NY 10017-2023
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