Patent Assignment Details
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| Reel/Frame: | 039475/0476 | |
| Pages: | 3 |
| | Recorded: | 08/18/2016 | | |
| Attorney Dkt #: | 18506-816US2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/01/2017
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Application #:
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15240291
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Filing Dt:
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08/18/2016
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Publication #:
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Pub Dt:
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12/08/2016
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF
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Assignee
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| NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
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2301 DUPONT DR. SUITE 510
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IRVINE, CA 92612
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