Patent Assignment Details
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Reel/Frame: | 020635/0478 | |
| Pages: | 3 |
| | Recorded: | 03/12/2008 | | |
Attorney Dkt #: | 1204.48396X00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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11996142
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Filing Dt:
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01/18/2008
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Publication #:
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Pub Dt:
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04/09/2009
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Title:
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THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, LEAD FRAME, AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
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Assignee
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1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, |
TOKYO, JAPAN 163-0449 |
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Correspondence name and address
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ANTONELLI, TERRY, STOUT & KRAUS, LLP
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1300 N. 17TH STREET
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SUITE 1800
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ARLINGTON, VA 22209
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