Patent Assignment Details
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| Reel/Frame: | 009552/0479 | |
| Pages: | 3 |
| | Recorded: | 10/26/1998 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/23/2001
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Application #:
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09178769
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Filing Dt:
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10/26/1998
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Title:
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SEMICONDUCTOR PACKAGE WITH A STACKED CHIP ON A LEADFRAME
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Assignee
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| NO. 2, LI-HSIN RD. 3, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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STEPHEN A. BECKER
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99 CANAL CENTER PLAZA
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SUITE 300
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ALEXANDRIA, VA 22314
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