Patent Assignment Details
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Reel/Frame: | 021771/0479 | |
| Pages: | 3 |
| | Recorded: | 10/31/2008 | | |
Attorney Dkt #: | 4591-655 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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12193561
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Filing Dt:
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08/18/2008
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Publication #:
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Pub Dt:
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02/19/2009
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Title:
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SEMICONDUCTOR CHIP PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR CHIP PACKAGE AND METHODS OF FABRICATING THE ELECTRONIC DEVICE
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Assignee
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416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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Correspondence name and address
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DEREK MEEKER
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210 SW MORRISON ST., SUITE 400
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PORTLAND, OR 97204
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