Patent Assignment Details
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| Reel/Frame: | 030455/0480 | |
| Pages: | 4 |
| | Recorded: | 05/21/2013 | | |
| Attorney Dkt #: | 16454-000002/US/NP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/16/2015
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Application #:
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13988555
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Filing Dt:
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05/21/2013
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Publication #:
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Pub Dt:
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09/19/2013
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Title:
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CERAMIC HEAT SINK MATERIAL FOR PRESSURE CONTACT STRUCTURE AND SEMICONDUCTOR MODULE USING THE SAME
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Assignees
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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| 8, SHINSUGITA-CHO |
| ISOGO-KU |
| YOKOHAMA-SHI, KANAGAWA-KEN, JAPAN 235-0032 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, PLC
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P. O. BOX 828
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MICHAEL E. HILTON, ESQ.
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BLOOMFIELD HILLS, MI 48303
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