Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067502/0481 | |
| Pages: | 4 |
| | Recorded: | 05/23/2024 | | |
| Attorney Dkt #: | M00061.0001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
10
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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11911416
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Filing Dt:
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10/12/2007
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Publication #:
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Pub Dt:
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09/11/2008
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Title:
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Method of Preparing Wear-Resistant Coating Layer Comprising Metal Matrix Composite and Coating Layer Prepared Thereby
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17884892
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Filing Dt:
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08/10/2022
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Publication #:
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Pub Dt:
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12/01/2022
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Title:
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CERAMIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC COMPONENT
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17884926
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Filing Dt:
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08/10/2022
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Publication #:
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Pub Dt:
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12/01/2022
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Title:
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CERAMIC COMPONENT AND PLASMA ETCHING APPARATUS COMPRISING SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17892425
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Filing Dt:
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08/22/2022
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Publication #:
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Pub Dt:
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12/22/2022
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Title:
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MANUFACTURING METHOD OF RING-SHAPED ELEMENT FOR ETCHER
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18349557
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Filing Dt:
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07/10/2023
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Publication #:
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Pub Dt:
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01/25/2024
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Title:
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FOCUS RING AND PLASMA ETCHING DEVICE INCLUDING SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18359953
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Filing Dt:
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07/27/2023
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Publication #:
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Pub Dt:
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02/15/2024
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Title:
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FOCUS RING AND PLASMA ETCHING APPARATUS COMPRISING THE SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18468903
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Filing Dt:
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09/18/2023
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Publication #:
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Pub Dt:
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05/02/2024
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Title:
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SINTERED BODY AND PARTS INCLUDING SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18468959
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Filing Dt:
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09/18/2023
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Publication #:
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Pub Dt:
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05/02/2024
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Title:
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SINTERED BODY AND METHOD OF MANUFACTURING SINTERED BODY
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18508446
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Filing Dt:
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11/14/2023
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Publication #:
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Pub Dt:
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05/16/2024
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Title:
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SINTERED BODY AND COMPONENT PART INCLUDING SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18512021
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Filing Dt:
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11/17/2023
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Publication #:
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Pub Dt:
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05/23/2024
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Title:
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COMPONENT FOR SEMICONDUCTOR DEVICE FABRICATION APPARATUS, SEMICONDUCTOR DEVICE FABRICATION APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
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Assignee
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| A-2F, 1043 GYEONGGI-DAERO, GYEONGGI-DO |
| PYEONGTAEK-SI, KOREA, REPUBLIC OF 17784 |
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Correspondence name and address
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NSIP LAW
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P.O. BOX 65745
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WASHINGTON, DC 20035
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