Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 012866/0482 | |
| Pages: | 2 |
| | Recorded: | 04/30/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/27/2004
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Application #:
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10099861
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Filing Dt:
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03/15/2002
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Publication #:
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Pub Dt:
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09/18/2003
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Title:
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LEAD-FREE SOLDER ALLOY AND SOLDER REFLOW PROCESS
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Assignee
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| LEGAL STAFF - MAIL CODE: 480-414-420 P.O. BOX 5052 |
| TROY, MICHIGAN |
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Correspondence name and address
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DELPHI TECHNOLOGIES, INC.
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JIMMY L. FUNKE
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LEGAL STAFF MAIL CODE CT10C
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P.O. BOX 9005
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KOKOMO, INDIANA 46904-9005
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