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Reel/Frame:024227/0482   Pages: 3
Recorded: 04/13/2010
Attorney Dkt #:3304.2.392.1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/06/2011
Application #:
12714441
Filing Dt:
02/27/2010
Publication #:
Pub Dt:
07/29/2010
Title:
CONDUCTIVE MODULE AND ASSEMBLY STRUCTURE HAVING SUCH CONDUCTIVE MODULE
Assignors
1
Exec Dt:
02/26/2010
2
Exec Dt:
02/26/2010
3
Exec Dt:
02/26/2010
4
Exec Dt:
02/26/2010
5
Exec Dt:
02/26/2010
6
Exec Dt:
02/26/2010
7
Exec Dt:
02/26/2010
8
Exec Dt:
02/26/2010
9
Exec Dt:
02/26/2010
10
Exec Dt:
02/26/2010
Assignee
1
NO. 31-1, SHIEN PAN ROAD, KUEI SAN INDUSTRIAL ZONE
TAOYUAN HSIEN, TAIWAN 333
Correspondence name and address
THOMAS M. HARDMAN
170 SOUTH MAIN STREET, SUITE 735
SALT LAKE CITY, UT 84101

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