Patent Assignment Details
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| Reel/Frame: | 014813/0485 | |
| Pages: | 3 |
| | Recorded: | 07/02/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/21/2006
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Application #:
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10710344
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Filing Dt:
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07/02/2004
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Publication #:
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Pub Dt:
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01/06/2005
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Title:
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CHIP PACKAGE STRUCTURE WITH DUAL HEAT SINKS
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Assignee
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| 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN 811 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7 FLOOR-1, NO. 100
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ROOSEVELT ROAD, SECTION 2
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TAIPEI, TAIWAN 100
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