Patent Assignment Details
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| Reel/Frame: | 016615/0485 | |
| Pages: | 3 |
| | Recorded: | 05/27/2005 | | |
| Attorney Dkt #: | 052634 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11138819
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Filing Dt:
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05/27/2005
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Publication #:
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Pub Dt:
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08/24/2006
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Title:
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Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same
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Assignee
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN 211-8588 |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS, ET AL.
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1250 CONNECTICUT AVENUE, N.W., SUITE 700
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WASHINGTON, D.C. 20036
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