Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 030768/0486 | |
| Pages: | 4 |
| | Recorded: | 07/10/2013 | | |
| Attorney Dkt #: | 092990D1C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
5
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2008
|
Application #:
|
10653628
|
Filing Dt:
|
09/02/2003
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2006
| | | | |
|
Title:
|
POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/29/2008
|
Application #:
|
11273071
|
Filing Dt:
|
11/14/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/30/2006
| | | | |
|
Title:
|
POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2007
|
Application #:
|
11273085
|
Filing Dt:
|
11/14/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/23/2006
| | | | |
|
Title:
|
POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/04/2007
|
Application #:
|
11273105
|
Filing Dt:
|
11/14/2005
|
|
Publication #:
|
|
Pub Dt:
|
04/13/2006
| | | | |
|
Title:
|
POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2008
|
Application #:
|
11273447
|
Filing Dt:
|
11/14/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/23/2006
| | | | |
|
Title:
|
POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
|
|
|
Assignee
|
|
|
|
|
| 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN ROC |
|
|
Correspondence name and address
|
| |
QUALCOMM INCORPORATED
|
| |
5775 MOREHOUSE DRIVE
|
| |
SAN DIEGO, CA 92121-1714
|
Search Results as of:
05/27/2024 10:32 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
