Patent Assignment Details
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| Reel/Frame: | 039822/0486 | |
| Pages: | 3 |
| | Recorded: | 09/22/2016 | | |
| Attorney Dkt #: | US47030 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/20/2015
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Application #:
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13968409
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Filing Dt:
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08/15/2013
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Publication #:
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Pub Dt:
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05/01/2014
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Title:
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PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME
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Assignees
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| NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
| QINHUANGDAO, CHINA |
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| NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE |
| TAYUAN, TAOYUAN, TAIWAN |
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Correspondence name and address
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ZHIGANG MA
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550 S. HOPE STREET, SUITE 2825
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LOS ANGELES, CA 90071
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