Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 065456/0487 | |
| Pages: | 7 |
| | Recorded: | 11/03/2023 | | |
| Attorney Dkt #: | 20901-158511-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18289495
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Filing Dt:
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11/03/2023
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Publication #:
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Pub Dt:
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07/18/2024
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Title:
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LEAD-FREE SOLDER PASTE
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Assignee
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| 1-16-15, ESAKACHO, SUITA-SHI |
| OSAKA, JAPAN 5640063 |
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Correspondence name and address
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FITCH EVEN TABIN & FLANNERY, LLP
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120 SOUTH LASALLE STREET
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SUITE 2100
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CHICAGO, 60603-3406 UNITED STATES
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08/12/2025 08:39 PM
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