Patent Assignment Details
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Reel/Frame: | 009282/0488 | |
| Pages: | 3 |
| | Recorded: | 06/24/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/11/2001
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Application #:
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09103918
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Filing Dt:
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06/24/1998
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Title:
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FLIP-CHIP PACKAGE UTILIZING A PRINTED CIRCUIT BOARD HAVING A ROUGHENED SURFACE FOR INCREASING BOND STRENGTH.
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Assignee
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SCIENCE-BASED INDUSTRIAL PARK |
123 PARK AVENUE 3RD |
HSINCHU 30077 R.O.C., TAIWAN |
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Correspondence name and address
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TUNG & ASSOCIATES
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RANDY W. TUNG
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838 W. LONG LAKE ROAD
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SUITE 120
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BLOOMFIELD HILLS, MI 48302
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