Patent Assignment Details
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| Reel/Frame: | 013072/0489 | |
| Pages: | 2 |
| | Recorded: | 06/28/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/04/2003
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Application #:
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10187134
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Filing Dt:
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06/28/2002
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Title:
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METHOD FOR FORMING INTERCONNECTION STRUCTURE IN AN INTEGRATION CIRCUIT
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 16, LI HSIN ROAD IV |
| HSINCHU, TAIWAN |
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Correspondence name and address
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SUPREME PATENT SERVICES
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JASON Z. LIN
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PO BOX 2339
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SARATOGA, CA 95070
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