Patent Assignment Details
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| Reel/Frame: | 018568/0489 | |
| Pages: | 3 |
| | Recorded: | 11/30/2006 | | |
| Attorney Dkt #: | 21CEN-009PUS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/28/2010
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Application #:
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11569839
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Filing Dt:
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11/30/2006
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Publication #:
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Pub Dt:
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01/17/2008
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Title:
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SILICON WAFER FOR PROBE BONDING AND PROBE BONDING METHOD USING THEREOF
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Assignee
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| 60-29 GASAN-DONG |
| KUMCHON-GU |
| SEOUL, KOREA, REPUBLIC OF 153-801 |
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Correspondence name and address
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PAUL D. DURKEE
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354A TURNPIKE STREET
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SUITE 301A
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CANTON, MA 02021-2714
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