Patent Assignment Details
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| Reel/Frame: | 015024/0490 | |
| Pages: | 2 |
| | Recorded: | 02/23/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10785176
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Filing Dt:
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02/23/2004
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Publication #:
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Pub Dt:
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08/25/2005
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Title:
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Method for fabricating interconnect and interconnect fabricated thereby
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Assignee
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| NO. 1, LI-HSIN RD. 2, |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU 300,, TAIWAN |
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Correspondence name and address
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THOMAS, KAYDEN, HORSTEMEYER & ET AL
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DANIEL R. MCCLURE
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100 GALLERIA PARKWAY, SUITE 1750
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ALTLANTA, GEORGIA 30339-5948
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