Patent Assignment Details
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| Reel/Frame: | 025515/0491 | |
| Pages: | 4 |
| | Recorded: | 12/17/2010 | | |
| Attorney Dkt #: | US32832 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/01/2013
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Application #:
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12970976
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Filing Dt:
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12/17/2010
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Publication #:
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Pub Dt:
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11/03/2011
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Title:
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LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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| NO. 13, GONGYE 5TH RD., HSINCHU INDUSTRIAL PARK,HUKOU SHIANG |
| HSINCHU HSIEN 303, TAIWAN |
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Correspondence name and address
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RAYMOND J. CHEW
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288 SOUTH MAYO AVENUE
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CITY OF INDUSTRY, CA 91789
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