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Patent #:
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Issue Dt:
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12/07/2004
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Application #:
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09802443
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Filing Dt:
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03/09/2001
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Publication #:
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Pub Dt:
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03/14/2002
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Title:
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FLIP CHIP-IN-LEADFRAME PACKAGE AND PROCESS
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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09802664
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Filing Dt:
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03/09/2001
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Publication #:
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Pub Dt:
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12/27/2001
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Title:
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A METHOD OF FORMING A FLIP CHIP INTERCONNECTION STRUCTURE
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Patent #:
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Issue Dt:
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09/06/2005
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Application #:
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10080384
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Filing Dt:
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02/22/2002
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Publication #:
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Pub Dt:
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10/17/2002
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Title:
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SELF-COPLANARITY BUMPING SHAPE FOR FLIP CHIP
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10081425
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Filing Dt:
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02/22/2002
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Publication #:
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Pub Dt:
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09/05/2002
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Title:
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APPARATUS AND PROCESS FOR PRECISE ENCAPSULATION OF FLIP CHIP INTERCONNNECTS
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10081490
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Filing Dt:
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02/22/2002
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Publication #:
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Pub Dt:
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11/07/2002
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Title:
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PLASTIC SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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05/18/2004
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Application #:
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10081491
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Filing Dt:
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02/22/2002
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Publication #:
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Pub Dt:
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10/17/2002
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Title:
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CHIP SCALE PACKAGE WITH FLIP CHIP INTERCONNECT
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Patent #:
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Issue Dt:
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04/15/2003
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Application #:
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10082914
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Filing Dt:
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02/26/2002
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Publication #:
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Pub Dt:
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09/12/2002
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Title:
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TAPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE STRUCTURE AND ASSEMBLY PROCESS
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Patent #:
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Issue Dt:
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11/22/2005
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Application #:
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10608843
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Filing Dt:
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06/27/2003
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Publication #:
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Pub Dt:
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03/04/2004
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Title:
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METHOD FOR MANUFACTURING PLASTIC BALL GRID ARRAY WITH INTEGRAL HEATSINK
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10618933
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Filing Dt:
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07/14/2003
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Publication #:
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Pub Dt:
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10/07/2004
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Title:
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SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING PROCESSOR AND MEMORY PACKAGE ASSEMBLIES
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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10632549
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
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12/06/2005
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Application #:
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10632550
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
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03/25/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE INCLUDING STACKED-DIE PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
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01/04/2005
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Application #:
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10632551
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
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04/08/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES AND HAVING ELECTRICAL SHIELD
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10632553
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-DOWN FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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10632568
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10681583
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Filing Dt:
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10/08/2003
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10681584
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Filing Dt:
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10/08/2003
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND INCLUDING ADDITIONAL DIE OR STACKED PACKAGE ON SECOND PACKAGE
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10681734
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Filing Dt:
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10/08/2003
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Publication #:
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Pub Dt:
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06/24/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED BUMP CHIP CARRIER SECOND PACKAGE
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Patent #:
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Issue Dt:
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06/14/2005
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Application #:
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10681747
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Filing Dt:
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10/08/2003
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Publication #:
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Pub Dt:
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06/17/2004
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
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Patent #:
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Issue Dt:
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08/23/2005
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Application #:
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10681833
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Filing Dt:
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10/08/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Title:
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SEMICONDUCTOR STACKED MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND ELECTRICALLY SHIELDED FIRST PACKAGE
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10850093
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Filing Dt:
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05/20/2004
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Publication #:
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Pub Dt:
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10/28/2004
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Title:
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FLIP CHIP INTERCONNECTION STRUCTURE
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Patent #:
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Issue Dt:
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05/06/2008
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Application #:
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10882078
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Filing Dt:
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06/30/2004
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Publication #:
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Pub Dt:
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02/03/2005
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Title:
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METHOD AND APPARATUS FOR FLIP CHIP ATTACHMENT BY POST COLLAPSE RE-MELT AND RE-SOLIDIFICATION OF BUMPS
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Patent #:
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Issue Dt:
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07/11/2006
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Application #:
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10959713
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Filing Dt:
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10/06/2004
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Publication #:
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Pub Dt:
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09/08/2005
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Title:
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DBG SYSTEM AND METHOD WITH ADHESIVE LAYER SEVERING
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Patent #:
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Issue Dt:
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08/05/2008
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Application #:
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10971202
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Filing Dt:
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10/22/2004
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Publication #:
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Pub Dt:
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10/06/2005
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Title:
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WIRE BOND CAPILLARY TIP
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Patent #:
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Issue Dt:
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12/11/2007
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Application #:
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10976601
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Filing Dt:
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10/29/2004
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Publication #:
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Pub Dt:
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09/22/2005
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Title:
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SEMICONDUCTOR CHIP PACKAGING METHOD WITH INDIVIDUALLY PLACED FILM ADHESIVE PIECES
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Patent #:
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Issue Dt:
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01/26/2010
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Application #:
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10977047
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Filing Dt:
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10/29/2004
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Publication #:
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Pub Dt:
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10/06/2005
| | | | |
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Title:
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BONDING TOOL FOR MOUNTING SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10983898
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Filing Dt:
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11/08/2004
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Publication #:
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Pub Dt:
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05/12/2005
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Title:
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FLIP CHIP INTERCONNECTION PAD LAYOUT
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Patent #:
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Issue Dt:
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05/06/2008
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Application #:
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10985654
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Filing Dt:
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11/10/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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BUMP-ON-LEAD FLIP CHIP INTERCONNECTION
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Patent #:
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Issue Dt:
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03/03/2015
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Application #:
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11014257
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Filing Dt:
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12/16/2004
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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Multiple chip package module having inverted package stacked over die
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Patent #:
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Issue Dt:
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04/06/2010
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Application #:
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11027002
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Filing Dt:
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12/31/2004
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Publication #:
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Pub Dt:
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07/21/2005
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Title:
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DIE ATTACH BY TEMPERATURE GRADIENT LEAD FREE SOFT SOLDER METAL SHEET OR FILM
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Patent #:
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Issue Dt:
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09/05/2006
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Application #:
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11059274
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Filing Dt:
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02/16/2005
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Publication #:
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Pub Dt:
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07/07/2005
| | | | |
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA) PACKAGE
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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11134845
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Filing Dt:
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05/20/2005
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Publication #:
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Pub Dt:
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12/08/2005
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Title:
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ADHESIVE/SPACER ISLAND STRUCTURE FOR STACKING OVER WIRE BONDED DIE
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Patent #:
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Issue Dt:
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05/19/2015
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Application #:
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11162622
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Filing Dt:
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09/16/2005
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Publication #:
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Pub Dt:
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08/03/2006
| | | | |
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Title:
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INTEGRATED, INTEGRATED CIRCUIT SINGULATION SYSTEM
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Patent #:
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Issue Dt:
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05/15/2007
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Application #:
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11213058
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Filing Dt:
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08/26/2005
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Publication #:
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Pub Dt:
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01/26/2006
| | | | |
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Title:
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METHOD FOR MANUFACTURING PLASTIC BALL GRID ARRAY PACKAGE WITH INTEGRAL HEATSINK
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Patent #:
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Issue Dt:
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04/24/2007
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Application #:
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11252193
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Filing Dt:
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10/17/2005
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Publication #:
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Pub Dt:
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04/20/2006
| | | | |
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Title:
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MULTICHIP LEADFRAME PACKAGE
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Patent #:
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Issue Dt:
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08/14/2007
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Application #:
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11252990
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Filing Dt:
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10/18/2005
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Publication #:
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Pub Dt:
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05/04/2006
| | | | |
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Title:
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METHOD FOR REDUCING SEMICONDUCTOR DIE WARPAGE
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Patent #:
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Issue Dt:
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11/18/2008
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Application #:
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11273635
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Filing Dt:
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11/14/2005
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Publication #:
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Pub Dt:
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06/01/2006
| | | | |
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Title:
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WIRE BOND INTERCONNECTION
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Patent #:
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Issue Dt:
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03/02/2010
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Application #:
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11274925
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Filing Dt:
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11/14/2005
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Publication #:
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Pub Dt:
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08/31/2006
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Title:
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SEMICONDUCTOR PACKAGE HAVING DOUBLE LAYER LEADFRAME
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Patent #:
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Issue Dt:
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11/29/2011
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Application #:
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11280971
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Filing Dt:
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11/15/2005
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Publication #:
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Pub Dt:
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08/31/2006
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Title:
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CHIP SCALE PACKAGE HAVING FLIP CHIP INTERCONNECT ON DIE PADDLE
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Patent #:
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Issue Dt:
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02/01/2011
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Application #:
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11282293
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Filing Dt:
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11/17/2005
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Publication #:
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Pub Dt:
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08/31/2006
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Title:
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SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBLE SPACER
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Patent #:
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Issue Dt:
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04/15/2014
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Application #:
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11307129
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Filing Dt:
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01/24/2006
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Publication #:
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Pub Dt:
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07/26/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING WIDE FLANGE LEADFRAME
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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11307382
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Filing Dt:
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02/03/2006
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Publication #:
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Pub Dt:
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08/09/2007
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Title:
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STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FACE TO FACE STACK CONFIGURATION
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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11307904
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Filing Dt:
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02/27/2006
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Publication #:
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Pub Dt:
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08/30/2007
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Title:
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STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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10/30/2007
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Application #:
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11337821
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Filing Dt:
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01/23/2006
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Publication #:
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Pub Dt:
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06/29/2006
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Title:
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METHOD FOR MAKING SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE AND INCLUDING ADDITIONAL DIE OR PACKAGE STACKED ON SECOND PACKAGE
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Patent #:
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Issue Dt:
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07/24/2007
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Application #:
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11337944
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Filing Dt:
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01/23/2006
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Publication #:
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Pub Dt:
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07/20/2006
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Title:
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METHOD FOR MAKING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED BUMP CHIP CARRIER SECOND PACKAGE
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Patent #:
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Issue Dt:
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04/22/2014
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Application #:
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11354806
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Filing Dt:
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02/14/2006
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Publication #:
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Pub Dt:
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08/16/2007
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Title:
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Integrated circuit package system with exposed interconnects
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Patent #:
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Issue Dt:
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12/11/2007
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Application #:
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11355920
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Filing Dt:
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02/16/2006
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Publication #:
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Pub Dt:
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07/13/2006
| | | | |
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Title:
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METHOD FOR MAKING A SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING A PROCESSOR AND MEMORY PACKAGE ASSEMBLIES
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Patent #:
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Issue Dt:
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01/16/2007
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Application #:
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11374383
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Filing Dt:
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03/13/2006
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Publication #:
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Pub Dt:
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08/03/2006
| | | | |
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING INVERTED SECOND PACKAGE STACKED OVER DIE-UP FLIP-CHIP BALL GRID ARRAY (BGA)
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Patent #:
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Issue Dt:
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10/09/2007
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Application #:
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11374468
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Filing Dt:
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03/13/2006
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Publication #:
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Pub Dt:
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08/03/2006
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Title:
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METHOD FOR MAKING A SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
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03/23/2010
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Application #:
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11374472
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Filing Dt:
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03/13/2006
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Publication #:
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Pub Dt:
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08/03/2006
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Title:
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SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-DOWN FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES
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Patent #:
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Issue Dt:
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12/02/2014
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Application #:
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11465744
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Filing Dt:
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08/18/2006
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Publication #:
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Pub Dt:
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02/21/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WINDOW OPENING
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Patent #:
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Issue Dt:
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11/24/2009
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Application #:
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11521974
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Filing Dt:
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09/14/2006
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Publication #:
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Pub Dt:
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03/20/2008
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Title:
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SEMICONDUCTOR ASSEMBLY WITH COMPONENT ATTACHED ON DIE BACK SIDE
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Patent #:
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Issue Dt:
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05/11/2010
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Application #:
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11525493
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01/25/2007
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05/22/2008
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11/20/2008
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