Patent Assignment Details
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| Reel/Frame: | 010396/0493 | |
| Pages: | 3 |
| | Recorded: | 11/15/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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09440595
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Filing Dt:
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11/15/1999
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Publication #:
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Pub Dt:
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06/27/2002
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Title:
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MULTIPLE SEMICONDUCTOR CHIP (MULTI-CHIP) MODULE FOR USE IN HIGH-POWER APPLICATIONS
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Assignee
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| 1251 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10020 |
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Correspondence name and address
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PHILIPS ELECTRONICS NORTH AMERICA CORP.
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STEVEN R. BIREN
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580 WHITE PLAINS ROAD
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TARRYTOWN, NY 10591
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