Patent Assignment Details
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Reel/Frame: | 019394/0493 | |
| Pages: | 2 |
| | Recorded: | 06/06/2007 | | |
Attorney Dkt #: | MR3517-137 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/17/2012
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Application #:
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11798655
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Filing Dt:
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05/16/2007
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Publication #:
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Pub Dt:
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05/01/2008
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Title:
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LIGHT EMITTING DIODE AND WAFER LEVEL PACKAGE METHOD, WAFER LEVEL BONDING METHOD THEREOF, AND CIRCUIT STRUCTURE FOR WAFER LEVEL PACKAGE
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Assignees
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5F., NO. 2, CHUANGYE RD. |
SINSHIH TOWNSHIP |
TAINAN COUNTY 744, TAIWAN R.O.C. |
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1F., NO. 1, LISING 1ST RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU CITY 300, TAIWAN R.O.C. |
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Correspondence name and address
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MORTON J. ROSENBERG
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE, SUITE 101
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ELLICOTT CITY, MARYLAND 21043
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