Patent Assignment Details
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Reel/Frame: | 020268/0493 | |
| Pages: | 3 |
| | Recorded: | 12/18/2007 | | |
Conveyance: | RE-RECORD TO CORRECT SPELLING OF 5TH INVENTOR'S NAME AND CORRECT SPELLING OF ASSIGNEE' NAME IN REEL/FRAME: 020182/0692-3 |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11898143
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Filing Dt:
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09/10/2007
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Publication #:
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Pub Dt:
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03/13/2008
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Title:
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Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
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Assignee
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290, GONGDAN 2-DONG, GUMI-SI |
GYEONGSANGBUK-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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EUGENE M. LEE
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LEE & MORSE, P.C.
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3141 FAIRVIEW PARK DRIVE, SUTIE 500
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FALLS CHURCH, VA 22042
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