Patent Assignment Details
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| Reel/Frame: | 008148/0495 | |
| Pages: | 3 |
| | Recorded: | 03/20/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/15/1998
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Application #:
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08577586
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Filing Dt:
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12/22/1995
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Title:
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APPLICATION OF LOW TEMPERATURE METALLURGICAL PASTE TO FORM A BOND STRUCTURE TO ATTACH AN ELECTRONIC COMPONENT TO A CARRIER
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Assignee
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| OLD ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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KARUNA OJANEN
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INTELLECTUAL PROPERTY LAW DEPT. 917
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3605 HIGHWAY 52 NORTH
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ROCHESTER, MN 55901-2829
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