Patent Assignment Details
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| Reel/Frame: | 025670/0496 | |
| Pages: | 4 |
| | Recorded: | 01/20/2011 | | |
| Attorney Dkt #: | 285706US2 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT LANGUAGE PREVIOUSLY RECORDED ON REEL 024819 FRAME 0288. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF THE ASSIGNOR'S INTEREST. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11344014
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Filing Dt:
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02/01/2006
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Publication #:
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Pub Dt:
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08/10/2006
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Title:
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Method of forming copper wiring layer
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Assignee
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| 1-9-2, HATARA-CHO |
| FUKAYA-SHI, SAITAMA, JAPAN 366-0032 |
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Correspondence name and address
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OBLON, SPIVAK, ET AL
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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