Patent Assignment Details
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Reel/Frame: | 031360/0496 | |
| Pages: | 4 |
| | Recorded: | 10/08/2013 | | |
Attorney Dkt #: | OGOSH267USA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13983786
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Filing Dt:
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09/30/2013
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Publication #:
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Pub Dt:
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01/09/2014
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Title:
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Two-Layered Copper-Clad Laminate Material, and Method for Producing Same
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Assignee
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6-3, OTEMACHI 2-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-8164 |
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Correspondence name and address
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WILLIAM BAK, HOWSON & HOWSON LLP
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BUILDING 620, SUITE 210
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350 SENTRY PARKWAY
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BLUE BELL, PA 19422
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