Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051443/0496 | |
| Pages: | 13 |
| | Recorded: | 01/08/2020 | | |
| Attorney Dkt #: | 2515.5044 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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02/22/2022
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Application #:
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16558135
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Filing Dt:
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09/01/2019
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Publication #:
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Pub Dt:
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01/02/2020
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Title:
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Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)
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Patent #:
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Issue Dt:
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09/21/2021
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Application #:
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16570049
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Filing Dt:
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09/13/2019
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Publication #:
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Pub Dt:
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01/02/2020
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Title:
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Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
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Assignee
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| NO. 500 LINJIANG ROAD |
| YUECHENG DISTRICT |
| SHAOXING, CHINA |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C.
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123 W CHANDLER HEIGHTS ROAD, #12535
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CHANDLER, AZ 85248
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