Patent Assignment Details
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Reel/Frame: | 067567/0496 | |
| Pages: | 11 |
| | Recorded: | 05/30/2024 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC LTD. AND CORRECT THE NAME OF RECEIVING PARTY DATA FROM STATS CHIPPAL PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 64838 FRAME: 948. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/24/2009
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Application #:
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11462588
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Filing Dt:
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08/04/2006
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Publication #:
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Pub Dt:
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02/07/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND MANUFACTURING METHOD THEREOF
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Assignee
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE |
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Correspondence name and address
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YANGZHOU DU
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8407 CENTRAL AVE, SUITE 2077
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NEWARK, CA 94560-3431
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06/27/2024 03:53 PM
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