Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 010134/0497 | |
| Pages: | 5 |
| | Recorded: | 07/26/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/30/2002
|
Application #:
|
09360785
|
Filing Dt:
|
07/26/1999
|
|
Publication #:
|
|
Pub Dt:
|
08/09/2001
| | | | |
|
Title:
|
ENCAPSULATION METHODS FOR SEMICONDUCTOR DIE PACKAGES
|
|
|
Assignee
|
|
|
|
|
| 8000 SOUTH FEDERAL WAY |
| C/O MONICA KESLING |
| BOISE, IDAHO 83706 |
|
|
Correspondence name and address
|
| |
WELLS, ST. JOHN ET AL.
|
| |
DAVID G. LATWESEN
|
| |
601 W. FIRST AVENUE, STE. 1300
|
| |
SPOKANE, WA 99201-3828
|
Search Results as of:
09/25/2024 01:52 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
