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Reel/Frame:066163/0497   Pages: 8
Recorded: 01/18/2024
Attorney Dkt #:1012-3582 / 2022P00136 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18217044
Filing Dt:
06/30/2023
Publication #:
Pub Dt:
01/11/2024
Title:
Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor
Assignors
1
Exec Dt:
07/03/2023
2
Exec Dt:
07/03/2023
3
Exec Dt:
01/18/2024
4
Exec Dt:
07/24/2023
5
Exec Dt:
07/24/2023
6
Exec Dt:
07/24/2023
Assignee
1
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondence name and address
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
PO BOX 1959
CARY, NC 27512-1959

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