Patent Assignment Details
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| Reel/Frame: | 004669/0501 | |
| Pages: | 1 |
| | Recorded: | 02/10/1987 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/1988
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Application #:
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06940328
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Filing Dt:
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12/11/1986
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Title:
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CONTROL APPARATUS FOR REDUCING ADHESIVE FORCE OF ADHESIVE AGENT ADHERING BETWEEN SEMICONDUCTOR WAFER AND SUBSTRATE
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Assignee
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| NO. 23-23, HON-CHO, ITABASHI-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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ARMSTRONG, NIKAIDO, MARMELSTEIN &
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KUBOVCIK
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1725 K ST., N. W., STE. 912
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WASHINGTON, DC 20006
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