Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 027931/0502 | |
| Pages: | 5 |
| | Recorded: | 03/26/2012 | | |
| Conveyance: | CONFIRMATORY ASSIGNMENT |
|
|
Total properties:
8
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2008
|
Application #:
|
10497644
|
Filing Dt:
|
06/04/2004
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2005
| | | | |
|
Title:
|
METHOD OF AND DEVICE FOR PACKAGING ELECTRONIC COMPONENTS THUS PACKAGED
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/19/2008
|
Application #:
|
10525594
|
Filing Dt:
|
02/25/2005
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2005
| | | | |
|
Title:
|
WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDING TOOL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2007
|
Application #:
|
10548297
|
Filing Dt:
|
09/06/2005
|
|
Publication #:
|
|
Pub Dt:
|
09/14/2006
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE, SEMICONDUCTOR BODY AND METHOD OF MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/08/2010
|
Application #:
|
11572871
|
Filing Dt:
|
01/29/2007
|
|
Publication #:
|
|
Pub Dt:
|
07/30/2009
| | | | |
|
Title:
|
MODULE BASE UNIT WITH STRAIN RELIEF MEANS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2009
|
Application #:
|
11632518
|
Filing Dt:
|
11/05/2007
|
|
Publication #:
|
|
Pub Dt:
|
08/14/2008
| | | | |
|
Title:
|
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2010
|
Application #:
|
11632887
|
Filing Dt:
|
05/15/2008
|
|
Publication #:
|
|
Pub Dt:
|
01/15/2009
| | | | |
|
Title:
|
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT AND A CAPACITANCE ELEMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/2010
|
Application #:
|
12018089
|
Filing Dt:
|
01/22/2008
|
|
Publication #:
|
|
Pub Dt:
|
06/05/2008
| | | | |
|
Title:
|
DEVICE FOR PACKAGING AN ELECTRONIC COMPONENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/17/2012
|
Application #:
|
12815954
|
Filing Dt:
|
06/15/2010
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2010
| | | | |
|
Title:
|
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT AND A CAPACITANCE ELEMENT
|
|
|
Assignee
|
|
|
|
|
| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS 5656 AG |
|
|
Correspondence name and address
|
| |
DAVID L. SCHAEFFER
|
| |
411 EAST PLUMERIA DRIVE, MS 41
|
| |
NXP SEMICONDUCTORS, IP&L
|
| |
SAN JOSE, CA 95134
|
Search Results as of:
06/06/2024 11:16 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
