Patent Assignment Details
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Reel/Frame: | 059639/0502 | |
| Pages: | 4 |
| | Recorded: | 04/19/2022 | | |
Attorney Dkt #: | 1012-2927 / 2021P00087 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/12/2023
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Application #:
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17243056
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Filing Dt:
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04/28/2021
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Publication #:
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Pub Dt:
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11/03/2022
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Title:
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SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS AND RELATED METHODS OF MANUFACTURING
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Assignee
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY BILAK & HOMILLER/INFINEON TECHNO
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PO BOX 1959
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CARY, NC 27572-1959
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