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Patent Assignment Details
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Reel/Frame:066932/0502   Pages: 3
Recorded: 03/28/2024
Attorney Dkt #:023103.0223D1-D1C1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
05/28/2024
Application #:
17844344
Filing Dt:
06/20/2022
Publication #:
Pub Dt:
10/13/2022
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
2
Patent #:
NONE
Issue Dt:
Application #:
17940461
Filing Dt:
09/08/2022
Publication #:
Pub Dt:
01/05/2023
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
07/09/2020
Assignee
1
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO
CHEONGJU-SI, KOREA, REPUBLIC OF 28429
Correspondence name and address
NSIP LAW
P.O. BOX 65745
WASHINGTON, DC 20035

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