Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020978/0504 | |
| Pages: | 5 |
| | Recorded: | 05/21/2008 | | |
| Attorney Dkt #: | TW-GNA-0674 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNORS AND ASSIGNEES PREVIOUSLY RECORDED ON REEL 020964 FRAME 0135. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNORS: SHEN, GENG-SHIN, CHEN, YU-REN ASSIGNEES: CHIPMOS TECHNOLOGIES INC., CHIPMOS TECHNOLOGIES (BERMUDA) LTD.. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12122779
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Filing Dt:
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05/19/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Title:
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Multi-Chip Stacked Package Structure
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Assignees
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| NO. 1, R&D RD 1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM 12, BERMUDA |
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Correspondence name and address
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SINORICA, LLC
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528 FALLSGROVE DR.
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ROCKVILLE, MD 20850
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