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Reel/Frame:023983/0505   Pages: 8
Recorded: 02/24/2010
Attorney Dkt #:YOR920090307US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/02/2011
Application #:
12711455
Filing Dt:
02/24/2010
Publication #:
Pub Dt:
08/25/2011
Title:
DOUBLE-FACE HEAT REMOVAL OF VERTICALLY INTEGRATED CHIP-STACKS UTILIZING COMBINED SYMMETRIC SILICON CARRIER FLUID CAVITY AND MICRO-CHANNEL COLD PLATE
Assignors
1
Exec Dt:
02/23/2010
2
Exec Dt:
02/24/2010
3
Exec Dt:
02/23/2010
4
Exec Dt:
02/23/2010
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
PAUL J. OTTERSTEDT
1300 POST ROAD, SUITE 205
RYAN, MASON & LEWIS, LLP
FAIRFIELD, CT 06824

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