Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 040256/0506 | |
| Pages: | 4 |
| | Recorded: | 11/08/2016 | | |
| Attorney Dkt #: | APT1996-0243_CONS-DIVS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
7
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Patent #:
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Issue Dt:
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08/07/2001
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Application #:
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09301710
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Filing Dt:
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04/29/1999
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Title:
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LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
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Patent #:
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Issue Dt:
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08/21/2001
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Application #:
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09302083
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Filing Dt:
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04/29/1999
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Title:
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LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
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Patent #:
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Issue Dt:
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10/10/2000
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Application #:
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09417159
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Filing Dt:
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10/12/1999
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Title:
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LEADS UNDER CHIP IC PACKAGE
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09852868
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Filing Dt:
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05/10/2001
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Publication #:
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Pub Dt:
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10/18/2001
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Title:
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LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
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Patent #:
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Issue Dt:
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12/14/2004
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Application #:
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09918739
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Filing Dt:
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07/31/2001
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Publication #:
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Pub Dt:
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11/29/2001
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Title:
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METHODS FOR LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
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Patent #:
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Issue Dt:
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10/25/2005
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Application #:
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10300300
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Filing Dt:
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11/19/2002
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Publication #:
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Pub Dt:
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04/10/2003
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Title:
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LEADS UNDER CHIP IC PACKAGE
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Patent #:
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Issue Dt:
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08/01/2006
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Application #:
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11185346
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Filing Dt:
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07/20/2005
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Publication #:
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Pub Dt:
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11/10/2005
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Title:
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LEADS UNDER CHIP IC PACKAGE
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83707 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 E. MCDOWELL ROAD
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MAILDROP A700
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PHOENIX, AZ 85008
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