Patent Assignment Details
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Reel/Frame: | 044475/0510 | |
| Pages: | 4 |
| | Recorded: | 12/25/2017 | | |
Attorney Dkt #: | 70521-US-PA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/25/2018
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Application #:
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15795281
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Filing Dt:
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10/27/2017
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Title:
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INTEGRATED FAN-OUT PACKAGE, REDISTRIBUTION CIRCUIT STRUCTURE, AND METHOD OF FABRICATING THE SAME
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Assignee
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NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 10099 TAIWAN
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